JPH03128965U - - Google Patents
Info
- Publication number
- JPH03128965U JPH03128965U JP3888590U JP3888590U JPH03128965U JP H03128965 U JPH03128965 U JP H03128965U JP 3888590 U JP3888590 U JP 3888590U JP 3888590 U JP3888590 U JP 3888590U JP H03128965 U JPH03128965 U JP H03128965U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- hole
- pads
- filled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3888590U JPH03128965U (en]) | 1990-04-11 | 1990-04-11 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3888590U JPH03128965U (en]) | 1990-04-11 | 1990-04-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03128965U true JPH03128965U (en]) | 1991-12-25 |
Family
ID=31547295
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3888590U Pending JPH03128965U (en]) | 1990-04-11 | 1990-04-11 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03128965U (en]) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015076050A1 (ja) * | 2013-11-20 | 2015-05-28 | 日立オートモティブシステムズ株式会社 | 電子制御装置の実装構造 |
WO2018016144A1 (ja) * | 2016-07-21 | 2018-01-25 | Kyb株式会社 | 放熱構造 |
-
1990
- 1990-04-11 JP JP3888590U patent/JPH03128965U/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015076050A1 (ja) * | 2013-11-20 | 2015-05-28 | 日立オートモティブシステムズ株式会社 | 電子制御装置の実装構造 |
JPWO2015076050A1 (ja) * | 2013-11-20 | 2017-03-16 | 日立オートモティブシステムズ株式会社 | 電子制御装置の実装構造 |
WO2018016144A1 (ja) * | 2016-07-21 | 2018-01-25 | Kyb株式会社 | 放熱構造 |